TR/MG Brochure
UK_TR/MG_May2025_v6
Thermal Conductivity as Low as 0.024W/Mk,
Suitable for Fully Bonding with Approved Adhesive Systems,
A Solution to Water Ponding with Insulation and Drainage in a Single System,
Compatible with Adhesively Bonded Single Ply Roofing Membranes laid on Mechanically Fixed Boards
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